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期刊名称：ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS ISSN： 1539-9087 出版频率： Quarterly 出版社： ASSOC COMPUTING MACHINERY, 2 PENN PLAZA, STE 701, NEW YORK, USA, NY, 10121-0701   出版社网址： http://www.acm.org/ 期刊网址： http://acmtecs.acm.org/ 影响因子： 锟斤拷(2008) 主题范畴： COMPUTER SCIENCE, HARDWARE & ARCHITECTURE;    COMPUTER SCIENCE, SOFTWARE ENGINEERING 变更情况： SCIE2007锟疥开始锟斤拷录锟矫匡拷 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal The design of embedded computing systems, both the software and hardware, increasingly relies on sophisticated algorithms, analytical models, and methodologies. ACM Transactions on Embedded Computing Systems (TECS) aims to present the leading work relating to the analysis, design, behavior, and experience with embedded computing systems. Instructions to Authors Submission TECS can only accept papers in electronic form. When submitting a paper, before submission please check your document to following: no security settings set do not use Type 3 Fonts Otherwise your paper cannot be downloaded by the reviewers from manuscriptcentral and therefore your paper cannot be reviewed. To submit, use the TECS Web site. To aviod problems, PDF-Documents are preferred (main paper) Since the pagelimit is set to 25 pages, it is recommended to format your submission in paper in the style of ACM publications. You`ll find the template and formatting instructions here. If you want to write a cover letter, we reccomend to write it in the field "Author's Cover Letter:" instead of uploading a seperate file. Reviewprocess We strive to return a review result within six months of submission. We believe that this interval is long enough to ensure quality reviews but short enough to be fair to authors. Authors should direct their questions about the review process to the Assistant to Editor-in-chief. A revised submission should include responses to the reviewers' comments after the body of the revised paper. A good format is to list for each reviewer a summary of each comment followed by your response. The responses should be included at the end of the paper in the same file as the revised paper; this helps the editors and reviewers organize their evaluation Submitting a revision The reviewers appreciate it, when you put the Comments To Reviewers in the field "Author's Response". Only there the reviewers were able to read your response to the reviewers comments.  Acceptance After your paper is accepted, you will submit a publication packet to ACM Publications. The packet will include: 1.      Name and address of contact author, including email address and phone number; paper number and title. 2.      PDF or PostScript file of final version. 3.      Formatted source file (see MS-Word-Style or LaTeX-Style. Since there is no TECS in \documemtclass in the LaTeX-style, use TOCL instead) 4.      Figures in EPS or TIFF format. 5.      a copy/scan of the filled out and signed copyright form 6.      Computing Classification Systems terms. 7.      General terms. 8.      Additional keywords and phrases (www.acm.org/class/1998). Items 1 and 6 -8 can be included as a seperate file (plain text or PDF preferred) in the publication packet. The electronic files sholuld be included in a zip file. We appreciate it, if you name your packet with your submission number including revision. Please also mention the name of the Special Issue, if your contribution is ment for a special issue. Send the publication packet to the Assistant to Editor-in-Chief Following would be helpful for the Assistant and producer: 1.      include the electronic files in a compressed file (Zip files only) 2.      name your packet with your submission number including revision (eg. TECS-802701-9999.R4.zip) 3.      it is also helpful, you mention the title of the special issue, if your paper is accepted for a special issue. The Assistant/Editor in Chief sends your publication packet to ACM. Beside to the publication packet a copyright form is necessary. Download the form here and send it to ACM and include a copy/scan in the publication packet by fax (attn: Irma Strolia, fax ++1-212-869-0481) or by mail (ACM, 2 Penn Plaza, Suite 701, New York, NY 10121-0701). A paper publication depends on following: submission of your publication packet to the ASST/EIC submission of your signed copyright form to ACM After that the publication date depends on ACM/TECS publishers' total publication flow and is not a guaranteed date. Since each issue has a 320 page limit, the publication of your paper also depends on the amount of pages of the destined papers in the next issue. Postacceptance Production Process Questions regarding the postacceptance production process (e.g. publication date) should be addressed to the Managing Editor Joanne Pello Please check out our FAQ. For further questions, feel free to ask. We will answer within 48 hours. Editorial Board Editor-in-Chief J枚rg Henkel, Karlsruhe Institute of Technology Assistant     Martin Buchty, Karlsruhe Institute of Technology Associate Editors                                      Affiliation Rajeev     Alur                 University of Pennsylvania J眉rgen     Becker            Karlsruhe Institute of Technology Luca        Benini              University of Bologna Koen       Bertels            Delft University of Technology Greg        Byrd                NC State University Luca        Carloni            Columbia University in the City of New York Alain        Darte              ENS Lyon Nikil         Dutt                University of California, Irvine Stephen   Edwards          Columbia University in the City of New York Rolf         Ernst               Technical University of Braunschweig Masahiro Fujita              University of Tokyo Tony        Givargis           University of California, Irvine Yung        Hsiang Lu         Purdue University Sharon     Hu                  University of Notre Dame Ahmed     Jerraya            CEA-LETI, MINATEC Luciano    Lavagno           Politecnico di Torino Steve       Lin                  National Tsing Hua University Rabi        Mahapatra        Texas A&M University Radu       Marculescu       Carnegie Mellon University Al            Mok                University of Texas at Austin Vincent     Mooney            Georgia Institute of Technology Trevor      Mudge             University of Michigan Krishna    Palem             Rice University Sri           Parameswaran  The University of New South Wales Anand      Raghunathan    Purdue University Binoy       Ravindran        Virginia Tech Wolfgang Rosenstiel        University of T眉bingen Dimitrios   Serpanos         University of Patras Kang       Shin                The University of Michigan John        Stankovic         University of Virginia Don         Thomas           Carnegie Mellon University Norbert     Wehn              University of Kaiserslautern Marilyn    Wolf                Georgia Institute of Technology Hiroto       Yasuura           Kyushu University