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期刊名称:JOURNAL OF BUILDING PHYSICS

ISSN:1744-2591
出版频率:Quarterly
出版社:SAGE PUBLICATIONS LTD, 1 OLIVERS YARD, 55 CITY ROAD, LONDON, ENGLAND, EC1Y 1SP
  出版社网址:http://www.uk.sagepub.com/home.nav
期刊网址:http://www.uk.sagepub.com/journalsProdDesc.nav?prodId=Journal201633&
影响因子:0.552(2008)
主题范畴:CONSTRUCTION & BUILDING TECHNOLOGY

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

Journal of Building Physics (J. Bldg. Phys) is an international, peer-reviewed journal that publishes a high quality research and state of the art 鈥渋ntegrated鈥縫apers to promote scientifically thorough advancement of all the areas of non-structural performance of a building and particularly in heat, air, moisture transfer.

Our goal is to enhance deeper insight and understanding, and enable the development of scientifically-based design tools, which are crucial for the implementation of a performance-based engineering approach in building design.

Recently the scope of the journal has been broadened, in response to readers' interests--and as a result of the shift in focus of the leading-edge building research organizations. Formerly titled Journal of Thermal Envelope and Building Science, the vision of the JBP is to facilitate the integration and implementation of a scientific approach in building physics with the various domains of building performance.

Buildings have enormous impact on global environment, renewable and non-renewable resources and quality of life and durability of the building envelope is one of the critical elements deciding upon the sustainability of built environment. The journal's expanded coverage will stress durability and long-term performance of building envelope systems. Specific stress is placed on environmental aspects and thermal protection of materials, elements and components used construction.

Turn to the Journal of Building Physics for the latest advances in:

路 Heat, air, and moisture aspects of the building system

路 All types of insulation and building envelope materials and systems including polymeric, mineral, cellulose-based, and composites

路 New test procedures and improved methods of field measurement

路 Heat, Air and Moisture transfer modeling

路 Building interactions with the environment, occupants, and allied building materials, components, and sub-systems.

路 Green roofing, double skinned envelopes, interaction of building enclosure with mechanical systems and many other topics

The Journal provides two sections of peer reviewed papers: Research Papers and Technical Papers or generally shorter Technical Notes. The research papers have a publication priority so that the publication cycle is as short as possible. Technical papers provide valuable technology updates, and invited state-of-the-art papers written by recognized experts.

You can count on the Journal of Building Physics for in-depth coverage of both research and practice. Just complete the order form to tap into this wealth of information and ideas.

Abstracting/Indexing Services:
 Academic Search Alumni Edition

 Academic Search Complete

 Academic Search Premier

 Applied Mechanics Reviews

 Business Source Corporate

 Chemical Abstracts Service (CAS)

 Civil Engineering Abstracts

 Compendex

 Current Abstracts (EBSCO)

 Executive Daily Brief

 Health Source: Nursing/Academic Edition

 Inspec

 Mechanical Engineering Abstracts

 Metal Abs./METADEX

 Polyme Library / Rapra Abstracts

 Science & Technology Collection

 TOC Premier

 Vocational & Career Collection


Instructions to Authors

Now accepted into Science Citation Index

Journal of Building Physics understands the importance of peer review and all papers are reviewed by three reviewers. Journal of Building Physics operates a single-blind reviewing policy in which the reviewer鈥檚 name is always concealed from the submitting author.

INSTRUCTIONS FOR AUTHORS

Submitting Papers to the Journal:

1. Electronic submission of the manuscript as a PDF or MS Word file attached to an email message sent to mark.bomberg@gmail.com is the desired format for submission of papers.The paper should be submitted electronically with the following: (1) a submission letter, (2) the cover page, and (3) the main text of the paper. The submission letter, addressed to the editor should include the number of references from this Journal and the ISI listed journals taht are quoted in the paper. Look under ISI (www.isinet.com/journals) or ask the editor for such a list. In addition , one double-spaced hard copy and one electronic version (on a 3.5 in. disk or CD using Microsoft Word in an IBM/PC format) should be submitted to:

Editor, Mark Bomberg,

2022 Deerhurst Court,

Gloucester,

ON, K1J 8H1, Canada.

Revised manuscripts should be resubmitted in final print and electronic versions.

2. Centred title should be brief, followed by centred name, affiliation, address, country, and postal code (zip) of author(s). Indicate to whom correspondence and proofs should be sent, including a telephone number, fax number and e-mail address.

3. Include a 100-word abstract and a list of key words.

4. ILLUSTRATIONS

Artwork should be supplied as EPS files, or TIFF files at a minimum resolution of 300 dpi for superior reproduction.

Lettering should be planned for 50% reduction; text should be readable after reduction.

Illustrations should be referred to as Figure 1, Figure 2 etc.

5. JOURNAL AND BOOK REFERENCES should be identified in the text using the Harvard system listing name of author, if more than two authors use et al. and the year of publication).

6. TABLES. Number consecutively and type on a numbered, separate page.

Please use arabic numerals and supply a heading. Column headings should be explanatory and carry units (see example). Do not include vertical rules.

7. UNITS & ABBREVIATIONS. SI units should be used.

8. SYMBOLS. A list of symbols used and their meanings should be included if a

large number of symbols appears in the text.

9. PROOFS AND OFFPRINTS. Authors will receive page proofs, which

they should correct and return as soon as possible. Access to 25 free e-prints will be provided; the corresponding author will receive one complimentary copy of the journal for each contributor (maximum 5).

Disclaimer: The authors, editors, and publisher will not accept any legal responsibility for any errors or omissions that may be made in this publication. The publisher makes no warranty, express or implied, with respect to the material contained herein

11. HEADINGS. Your article should be structured into sections. Normally two headings are used as follows:

Main Subhead: DESIGN OF A MICROWAVE INSTALLATION [all capital letters, centred]

Secondary Subhead: Principal of the Design Method [capitalize first letter of main words, left justified]

12. EQUATIONS. Number equations with arabic numbers enclosed in parentheses at the right-hand margin. Type superscripts and subscripts clearly above or below the baseline, or mark them with a caret. Be sure that all symbols, letters, and numbers are distinguishable (e.g., 0 for zero, one or lowercase ''el'', ''vee'' or Greek nu).

13. PERMISSIONS. The author is responsible for obtaining releases from other publishers for SAGE to publish material copyrighted by someone else.

GENERAL

Neither the Journal Building Physics nor the editorial board is responsible for the views expressed by individual contributors in articles published in the Journal.

English Language Editing Services: Please click here for information on professional English language editing services recommended by SAGE.


Editorial Board

Editor:                           Mark Bomberg                           Concordia University, Canada

Editorial Board:            Marc Olivier Abadie                  University of La Rochelle, France

                                      R. Becker                                   Technion Israel Institute of Technology, Haifa

                                      Robert 膶ern媒                             Czech Technical University, Czech Republic

                                      Vasco Peixoto de Freitas         University of Porto, Portugal

                                      Dariusz Gawin                            Lodz Technical University, Poland

                                      John Grunewald                         Technical University of Dresden, Germany

                                      Christopher Hall                        University of Edinburgh, UK

                                      Shuichi Hokoi                            Kyoto University, Japan

                                      Andreas Holm                            Fraunhofer-Institut f眉r Bauphysik, Germany

                                      Hartwig M. Kuenzel                    University of Stuttgart, Germany

                                      Ardeshir Mahdavi                      Vienna University of Technology, Austria

                                      Peter Matiasovsky                    Slovak Academy of Sciences, Bratislava, Slovakia

                                      Nathan Mendes                         PUCPR - Catholic University of Paran脿, Brazil

                                      Donald M. Onysko                     DMO Associates, Canada

                                      Bernard Perrin                           Paul Sabatier University, Toulouse, France

                                      Jerzy A. Pogorzelski                  Building Research Institute, Poland

                                      Carsten Rode                             Technical University of Denmark, Denmark, UK

                                      S. Roels                                      Catholic University of Leuven, Belgium, UK

                                      Carey J. Simonson                    University of Saskatchewan, Canada

                                      Xing Shi                                      Southeast University, China

                                      Kenneth Wilkes                          Oak Ridge National Laboratory, TN, USA

                                      David W. Yarbrough                   R & D Services, Inc, USA

                                      Jianshun S Zhang                      Syracuse University, USA



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