期刊名称：SOLDERING & SURFACE MOUNT TECHNOLOGY
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
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Soldering & Surface Mount Technology provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to all areas of soldering and surface mount technology. An accredited journal, Soldering & Surface Mount Technology complements its sister publications, Microelectronics International and Circuit World and is the official publication of the SMART Group (Surface Mount and Related Technologies) UK and Ireland. |
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Instructions to Authors
Copyright
Articles submitted to the journal should be original contributions and should not be under consideration for any other publication at the same time. Authors submitting articles for publication warrant that the work is not an infringement of any existing copyright and will indemnify the publisher against any breach of such warranty. For ease of dissemination and to ensure proper policing of use, papers and contributions become the legal copyright of the publisher unless otherwise agreed. Submissions should be sent to:
The Editor
David Whalley,
c/o MCB UP Ltd,
60/62 Toller Lane,
Bradford,
West Yorkshire
BD8 9BY,
UK.
Enquiries to Sharon Parkinson (Managing Editor) at MCB UP Ltd.
Tel: +44 (0) 1274 777700;
Fax: +44 (0) 1274 785200;
E-mail: sparkinson@emeraldinsight.com
Editorial objectives
Soldering & Surface Mount Technology provides an authoritative, independent and international forum for the exchange of information pertaining to the research, development and application of all branches of soldering and surface mount technologies. It makes an important contribution to the technical body of knowledge and expertise in this vital area.
Soldering & Surface Mount Technology complements its sister publications, Circuit World and Microelectronics International. Soldering & Surface Mount Technology is published in association with the SMART Group (Surface Mount and Related Technologies), UK and Ireland.
Editorial scope
The journal comprises a multi-disciplinary study of the key technologies relating to the assembly of printed circuit boards (PCBs) and the interconnection of electronic components and other devices onto the printed board.
Among the broad range of topics covered are:
- surface mount technology (SMT);
- surface mount assembly;
- soldering;
- solders, pastes and fluxes;
- screen printing and liquid deposition;
- conductive adhesives;
- conformal coatings;
- inspection and test;
- packaging and interconnection;
- quality control;
- rework and repair;
- encapsulants;
- cleaning;
- environmental.
Soldering & Surface Mount Technology's contributors, subscribers and readers are a mix of leading researchers, technical staff and practising engineers, both from within academia and the electronics assembly industry, contract manufacturers, ordinary equipment manufacturers (OEMs), users and all academic branches of engineering together with their information providers, academic, institutional, technical and corporate libraries.
Material for publication is welcomed in the form of state-of-the-art technical and research papers, case studies, experimental procedures, review articles and short communications.
News items should be forwarded on to the Associate Editor,
Trevor Galbraith at Electronics Marketing Ltd.
Tel: +44 (0) 1458 832137;
Fax: +44 (0) 1458 832143.
The reviewing process
The Editor, in association with other subject experts, reviews each paper for validity and general relevance to the publication.
Emerald Literati Editing Service
The Literati Club can recommend the services of a number of freelance copy editors, all themselves experienced authors, to contributors who wish to improve the standard of English in their paper before submission. This is particularly useful for those whose first language is not English.
http://www.emeraldinsight.com/literaticlub/editingservice.htm
Manuscript requirements
Three copies of the manuscript should be submitted in double line spacing with wide margins. All authors should be shown and author's details must be printed on a separate sheet and the author should not be identified anywhere else in the article.
As a guide, articles should be between 3,000 and 6,000 words in length. A title of not more than eight words should be provided. A brief autobiographical note should be supplied including full name, affiliation, e-mail address and full international contact details. Authors must supply an abstract of 100-150 words. Up to six keywords should be included which encapsulate the principal subjects covered by the article.
Where there is a methodology, it should be clearly described under a separate heading. Headings must be short, clearly defined and not numbered. Notes or Endnotes should be used only if absolutely necessary and must be identified in the text by consecutive numbers, enclosed in square brackets and listed at the end of the article.
Figures, charts and diagrams should be kept to a minimum. They should be provided both electronically and as good quality originals. They must be black and white with minimum shading and numbered consecutively using arabic numerals.
Artwork should be either copied or pasted from the origination software into a blank Microsoft Word document, or saved and imported into a blank Microsoft Word document. Artwork created in MS Powerpoint is also acceptable. Artwork may be submitted in the following standard image formats: .eps - Postscript, .pdf - Adobe Acrobat portable document, .ai - Adobe Acrobat portable document, .wmf - Windows Metafile. If it is not possible to supply graphics in the formats listed above, authors should ensure that figures supplied as .tif, .gif, .jpeg, .bmp, .pcx, .pic, .pct are supplied as files of at least 300 dpi and at least 10cm wide.
In the text the position of a figure should be shown by typing on a separate line the words "take in Figure 2". Authors should supply succinct captions.
For photographic images good quality original photographs should be submitted. If submitted electronically they should be saved as tif files of at least 300dpi and at least 10cm wide. Their position in the text should be shown by typing on a separate line the words "take in Plate 2".
Tables should be kept to a minimum. They must be numbered consecutively with roman numerals and a brief title. In the text, the position of the table should be shown by typing on a separate line the words "take in Table IV".
Photos and illustrations must be supplied as good quality black and white original half tones with captions. Their position should be shown in the text by typing on a separate line the words "take in Plate 2".
References to other publications should be complete and in Harvard style. They should contain full bibliographical details and journal titles should not be abbreviated. For multiple citations in the same year use a, b, c immediately following the year of publication. References should be shown within the text by giving the author's last name followed by a comma and year of publication all in round brackets, e.g. (Fox, 1994). At the end of the article should be a reference list in alphabetical order as follows
(a) for books
surname, initials and year of publication, title, publisher, place of publication, e.g.Casson, M. (1979), Alternatives to the Multinational Enterprise, Macmillan, London.
(b) for chapter in edited book
surname, initials and year, "title", editor's surname, initials, title, publisher, place, pages, e.g.Bessley, M. and Wilson, P. (1984), "Public policy and small firms in Britain", in Levicki, C. (Ed.), Small Business Theory and Policy, Croom Helm, London, pp.111-26. Please note that the chapter title must be underlined.
(c) for articles
surname, initials, year "title", journal, volume, number, pages, e.g.Fox, S. (1994) "Empowerment as a catalyst for change: an example from the food industry", Supply Chain Management, Vol 2 No 3, pp. 29-33
If there is more than one author list surnames followed by initials. All authors should be shown.
Electronic sources should include the URL of the electronic site at which they may be found, as follows:
Neuman, B.C.(1995), "Security, payment, and privacy for network commerce", IEEE Journal on Selected Areas in Communications, Vol. 13 No.8, October, pp.1523-31. Available (IEEE SEPTEMBER) http://www.research.att.com/jsac/
Notes/Endnotes should be used only if absolutely necessary. They should, however, always be used for citing Web sites. They should be identified in the text by consecutive numbers enclosed in square brackets and listed at the end of the article. Please then provide full Web site addresses in the end list.
Final submission of the article
Once accepted for publication, the final version of the manuscript must be provided, accompanied by a 3.5" disk of the same version labelled with: disk format; author name(s); title of article; journal title; file name.
Each article must be accompanied by a completed and signed Journal Article Record Form available from the Editor or on http://www.emeraldinsight.com/literaticlub Authors should note that proofs are not supplied prior to publication.
The manuscript will be considered to be the definitive version of the article. The author must ensure that it is complete, grammatically correct and without spelling or typographical errors.
In preparing the disk, please use one of the following preferred formats: Word, Word Perfect, Rich text format or TeX/LaTeX.
Technical assistance is available from Emerald's Literati Club on http://www.emeraldinsight.com/literaticlub or by contacting Mike Massey at Emerald, e-mail mmassey@emeraldinsight.com.
- A summary of submission requirements:
- Good quality hard copy manuscript
- A labelled disk
- A brief professional biography of each author
- An abstract and keywords
- Figures, photos and graphics electronically and as good quality originals
- Harvard style references where appropriate
- A completed Journal Article Record form
Editorial Board
Editor
David C. Whalley,
Department of Manufacturing Engineering,
University of Loughborough,
Leicestershire,
UK,
Email:d.c.whalley@lboro.ac.uk
Founding Editor
William Goldie
Electrochemical Publications Ltd
Asahi House, 10 Church Road
Port Erin, Isle of Man IM99 8HD
UK
Tel: +44 (0)1624 834941
Fax: +44 (0)1624 835400
E-mail: editor@elchempub.com
Associate Editor
Trevor Galbraith
Advertising enquiries and news items:
Trevor Galbraith,
Electronics Marketing Ltd,
PO Box 2521, 65 High Street,
Glastonbury,
Somerset,
BA6 9DS,
UK. Tel: +44 (0) 1458 832137;
Fax: +44 (0) 1458 832143;
ISDN: +44 (0) 1458 832119;
Email: eml@enterprise.net
Internet editor
Brian Ellis,
Email: b_ellis@protonique.com
Book review editor
Bob Willis,
Process Engineering Consultant,
Electronic Presentation Services,
Essex,
UK
Editorial Advisory Board
Mr David Boswell
Dorset
UK
Professor Y C Chan
City University of Hong Kong
Hong Kong
Mr Peter Grundy
PG Engineering (Sussex),
Brighton,
UK
Dr Jennie S Hwang
H Technologies Group Inc
Cleveland, OH
USA
Dr John N Lau
Agilent Technologies Inc
Palo Alto, CA
USA
Dr Ning-Cheng Lee
Indium Corporation of America
New York
USA
Professor Ricky S-W Lee
Hong Kong University of Science & Technology
Kowloon
Hong Kong
Professor Johan Liu
Chalmers University of Technology
Molndal
Sweden
Dr A Martinez
Chase Advanced Technologies Ltd
Bradford
UK
Professor Kyung-Wook Paik
KAIST
Korea
Professor W J Plumbridge
The Open University
Milton Keynes
UK
Dr Wallace Rubin
International Consultant
Northwood
UK
Dr Kiat Choon Teo
Delphi Automotive Systems Singapore Pte Ltd
Singapore
Professor Laura J Turbini
University of Toronto
Canada
Mr Martin Wickham
The Suface Mount Club
Hayling Island
UK
Mr Bob Willis
Electronic Presentation Services
Chelmsford
UK
Professor Sung Yi
Portland State University
Portland, OH
USA
Managing Editor
Sharon Parkinson
E-mail: sparkinson@emeraldinsight.com
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