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期刊名称：MACHINE VISION AND APPLICATIONS ISSN： 0932-8092 出版频率： Bimonthly 出版社： SPRINGER-VERLAG, 175 FIFTH AVE, NEW YORK, NY, 10010   出版社网址： http://www.springerlink.com/ 期刊网址： http://www.springerlink.com/app/home/journal.asp?wasp=gpt919ygrhckykqkjj1q&referrer=parent&backto=browsepublicationsresults,308,498; 影响因子： 1.485(2008) 主题范畴： COMPUTER SCIENCE, CYBERNETICS;    COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE;    ENGINEERING, ELECTRICAL & ELECTRONIC 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal Machine Vision and Applications Machine Vision and Applications publishes high-quality technical contributions in machine vision research and development. Specifically, the editors encourage submittals in all applications and engineering aspects of image-related computing. In particular, original contributions dealing with scientific, commercial, industrial, military, and biomedical applications of machine vision, are all within the scope of the journal.  Particular emphasis is placed on engineering and technology aspects of image processing and computer vision. The following aspects of machine vision applications are of interest: algorithms, architectures, VLSI implementations, AI techniques and expert systems for machine vision, front-end sensing, multidimensional and multisensor machine vision, real-time techniques, image databases, virtual reality and visualization. Papers must include a significant experimental validation component.   Abstracted/Indexed in: CompuMath Citation Index, Current Contents, Research Alert, SciSearch, Science Citation Instructions to Authors Manuscript submission Manuscript Submission Permissions Online Submission   Manuscript Submission Submission of a manuscript implies: that the work described has not been published before; that it is not under consideration for publication anywhere else; that its publication has been approved by all co-authors, if any, as well as by the responsible authorities – tacitly or explicitly – at the institute where the work has been carried out. The publisher will not be held legally responsible should there be any claims for compensation. Permissions Authors wishing to include figures, tables, or text passages that have already been published elsewhere are required to obtain permission from the copyright owner(s) for both the print and online format and to include evidence that such permission has been granted when submitting their papers. Any material received without such evidence will be assumed to originate from the authors. Online Submission Authors should submit their manuscripts online. Electronic submission substantially reduces the editorial processing and reviewing times and shortens overall publication times. Please follow the hyperlink “Submit online” on the right and upload all of your manuscript files following the instructions given on the screen. Instructions to Authors 0932-8092.pdf Editorial Board   Editor-in-Chief Mohan M. Trivedi Electrical and Computer Engineering Department University of California at San Diego La Jolla, CA 92093-0407, USA e-mail: trivedi@ece.ucsd.edu Fax: (619) 534-0415 Phone: (619) 822-0075 Editorial Coordinator Patricia Campbell 10451 Caminito Alvarez San Diego, CA 92126, USA e-mail: p3@san.rr.com Fax: (858) 535-3204 Phone: (858) 483-4297 Editorial Board J. K. Aggarwal University of Texas, Austin, TX, USA Chris Bowman Industrial Research Limited Auckland, New Zealand Kevin W. Bowyer University of Notre Dame Notre Dame, IN, USA Yoram Bresler University of Illinois at Urbana-Champaign Urbana, IL, USA Henrik I. Christensen Royal Institute of Technology (KTH) Stockholm, Sweden Ernst D. Dickmanns Universität der Bundeswehr München, Germany Masakazu Ejiri Hitachi Ltd., Tokyo, Japan Olivier D. Faugeras INRIA, Antipolis, France Leonard Ferrari University of California Irvine, CA, USA Ramesh Jain University of California, San Diego La Jolla, CA, USA Rangachar Kasturi The Pennsylvania State University University Park, PA, USA Josef Kittler University of Surrey, Guildford, UK Stefano Levialdi University of Rome, Rome, Italy Shih-Ping Liou Siemens Corporate Research Center Princeton, NJ, USA Roger Mohr Unité de Recherche INRIA Rhône-Alpes 38330 Montbonnot Saint Martin, France Lawrence O'Gorman Avaya Labs Basking Ridge, NJ, USA André Oosterlinck Katholieke Universiteit Leuven Heverlee, Belgium Dragutin Petkovic San Francisco State University San Francisco, CA, USA Jeffrey Price University of California, San Diego La Jolla, CA, USA A. Ravishankar Rao IBM T.J. Watson Research Center Yorktown Heights, NY, USA Richard A. Robb Mayo Clinic, Rochester, MN, USA Ishwar K. Sethi Wayne State University, Detroit, MI, USA Mubarak Shah University of Central Florida, Orlando, FL, USA Jack Sklansky University of California Irvine, CA, USA Yasuhito Suenaga Nippon Telegraph & Telephone Corp. Kanagawa, Japan Daphna Weinshall The Hebrew University of Jerusalem Jerusalem, Israel Jian-Kang Wu National University of Singapore Singapore