期刊名称：INTERNATIONAL JOURNAL OF ENGINEERING EDUCATION
|
ISSN： | 0949-149X
|
|
出版频率： | Bimonthly
|
|
出版社： | TEMPUS PUBLICATIONS, DUBLIN INST TECHNOLOGY,BOLTON ST, DUBLIN, IRELAND
|
|
出版社网址： | http://www.ijee.dit.ie/
|
|
期刊网址： | http://www.ijee.dit.ie/
| |
影响因子： | 0.552(2008) |
| 主题范畴： | ENGINEERING, MULTIDISCIPLINARY; EDUCATION, SCIENTIFIC DISCIPLINES |
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
- This journal serves as an international interdisciplinary forum of reference for engineering education.
- A balance between papers on developments in educational methods technology, case studies, laboratory applications, new theoretical approaches, educational policy and survey papers is aimed for.
- Comprehensive coverage of new education schemes and techniques makes the journal a unique source of ideas for engineering educators who are keen to keep abreast of latest developments in educational applications in all fields of engineering.
- Some of the areas covered more extensively in recent issues are:
CAD,
CAE,
computer applications in teaching thermodynamics,
material science,
electrical engineering,
new courses and curricula,
engineering management,
control engineering,
mechanical engineering,
engineering design,
student evaluation and institutional accreditation.
Instructions to Authors
IMPORTANT ANNOUNCEMENT
FOR AUTHORS
Statement from the Editor
Papers-on-Line
These papers are available on the Web only.
They are not published in print
Interactive Online Papers
The International Journal of Engineering Education is now publishing papers in animated interactive form as well as in hardcopy.
We invite authors to submit papers in both forms.
The first paper accepted for publication in
interactive and hardcopy form is
Timothy A. Philpot, Nancy Hubing, Ralph E. Flori,
Richard H. Hall, David B. Oglesby, Vikas Yellamraju,
University of Missouri-Rolla
Please click on the title to view the paper.
View Sample Copy
Submit your details here and you will receive
information on how to view sample copy.
Important announcement for authors intending
to submit papers for publication
|
The International Journal of Engineering Education has recently been receiving a substantial number of papers of high quality which have been accepted for publication. We have increased page numbers by over 50 percent in the past year. This has, however not eliminated the accumulation of accepted papers.
In order to ensure publication of accepted papers and in order to cover costs for increasing our page numbers further, we are introducing page charges for accepted papers. The initial charges are US$300 for up to 6 journal pages. Further pages will be charged at US$50 per each additional page. Authors from institutional subscribers will receive a 20 percent reduction on these charges.
The page charges will include an offer of a personal online full-text subscription for IJEE for a period of one year. Upon acceptance authors will receive a personal username and password. Authors will be requested to confirm their agreement to the charges before publication.
Publication will follow in the first available issue published after remittance of the page charges, thereby ensuring rapid turnaround.
ONLINE Papers
Papers accepted for publication online will be published in this form only. These papers undergo refereeing corresponding to the procedures for printed papers.
Some online papers have link references which can be connected to from the paper itself.. For details see our current policy statement link.
This service is free for an initial trial period.
Online papers published May 2001
1. Hiroshi Higuchi
Multi-level, interactive web-based simulations to teach fluid mechanics and aerodynamics from middle school to college levels
2. Caroline Baillie, Fiona Lamb,Mike Bramhall
A new network of development for Engineering Education in the UK
Published August 2001
3. Aftab Ahmad
Challenges for the next Integration of Network Technologies
|
Editorial Board
EDITOR-IN-CHIEF
M. S. Wald, Dublin Institute of Technology, Bolton Street, Dublin 1, IRELAND
Tel. +353 27 61400; Fax: (+353) 27 62895
E-mail: ijee@eircom.net
Website: Home Page
ASSOCIATE EDITORS
L. S. Fletcher, Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843, USA
E-mail: sfletcher@mengr.tamu.edu
C. Kuo, University of Strathclyde, 100 Montrose Street, Glasgow G4 0LZ, Scotland. Tel.: +44 41 5524400
E-mail: clhs22@strath.ac.uk
D. McCarthy, Dublin Institute of Technology, Bolton Street, Dublin 1, Ireland
E-mail: dmccart@dit.ie
M. Murphy, Dublin Institute of Technology, Bolton Street, Dublin 1, Ireland
J. Turner, Dublin Institute of Technology, Bolton Street, Dublin 1, Ireland
E-mail: jturner@dit.ie
BOARD OF EDITORS
C. Y. Lam, School of Mechanical and Production Engineering, Nanyang Technological, Singapore 639798
E-mail: mcylam@ntu.edu.sg
R. Natarajan, Chairman, All India Council for Technical Education, New Delhi, India.
E-mail: natarajan@aicte.ernet.in
C. S. Slater, Rowan University, Department of Chemical Engineering, Glassboro, NJ, USA
E-mail: slater@rowan.edu
S. Waks, Department of Education in Technology & Science, Israel Institute of Technology, Haifa 32000, Israel
EDITORIAL ADVISORY BOARD
Caroline Baillie,Integrated Learning Centre, Queens University, Kingston, Ontario, Canada K7L 3N6
E-Mail: c.baillie@ilc.queensu.ca
Freimut Bodendorf, Department of Information Systems, University of Nuremberg- Erlangen,Germany
Freimut.bodendorf@wiso.uni-erlangen.de
E. Eder, Royal Military College of Canada, Kingston, Ontario, Canada K7K 5LO
E-mail: eder-e@rmc.ca
Nesimi Ertugrul, Dept.of Electrical and Electronic Engineering, University of Adelaide,Adelaide 5005, Australia
E-mail: nesimi.ertugrul@adelaide.edu.au
Ivan Gibson, Department of Industrial Engineering, National University of Ireland, Galway, Ireland
E-mail: Ivan.Gibson@nuigalway.ie
Denis Gillet, EPFL, Swiss Federal Institute of Technology, CH-1015 ,Switzerland
E-mail: denis.gilet@epfl.ch
J. Jawitz, Faculty of Engineering and the Built Environment, University of Cape Town, South Africa
E-mail: jjawitz@eng.uct.ac.za
Russel C. Jones, Managing Partner, World Expertise LLC, Falls Church VA, USA
E-mail: rcjonespe@aol.com
Paul King, Department of Biomedical Engineering, Vanderbilt University, Nashville TN 37253, USA
E-mail: Paul.h.king@vanderbilt.edu
T. Kurfess, Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA
E-mail: tom.kurfess@me.gatech.edu
Kim Mallalieu, Electrical & Computer Engineering, University of the West Indies, St. Augustine, Trinidad
E-mail: kim.i.mallalieu@uwi.tt
J. F. Marchman, virginia Polytechnic Institute and State University, Blacksburg VA 24061, USA
E-mail: marchman@vt.edu
Etsuo Morishita, Department of Aeronautics & Astronautics, University of Tokyo, Japan
E-mail: morisita@fanno.t.u-tokyo.ac.jp
C. Newberry, Aeronautics and Astronautics, Naval Postgraduate School, Monterey, CA 93943, USA
E-mail: newberry@aa.nps.navy.mil
Terrance O払rien, Department of Curriculum & Instruction, North Carolina State University, Raleigh NC 27695, USA
E-mail: Terry_obrien@ncsu.edu
Tom Owens, Department of Electrical Engineering & Electronics, Brunel University, Uxbridge,UK
E-mail: Thomas.owens@brunel.ac.uk
Shirley Pomeranz, Associate Professor, Department of Mathematical and Computer Sciences, The University of Tulsa, Tulsa, OK 74104-3189
E-mail: pomeranz@euler.mcs.utulsa.edu
Z. J. Pudlowski, Faculty of Engineering, Monash University, Clayton, Melbourne, Vic 3168, Australia
E-mail: zjp@eng.monash.edu.au
Nicholas Salamon, Engineering Science & Mechanics, Penn State University, University Park, PA 16802, USA
E-mail: njsalamon@psu.edu
Sheri Sheppard, Mechanical Engineering, Stanford University, Stanford CA 94305, USA
E-mail: Sheppard@cdr.stanford.edu
P. Shiue, Christian Brothers University, Memphis TN 38104, USA
E-mail: pshiue@cbu.edu
2003 Subscription Rates (Including Postage and Insurance)
Annual institutional subscription rate ?95. Personal subscription rate for those whose library subscribes ?5 / $150.
For North American institutional subscribers $590. Subscription enquiries should be sent to:
TEMPUS Publications, Dublin Institute of Technology, Bolton St., Dublin 1, Ireland. Tel: +353 27 61400, Fax: (+353) 27 62895
Back Issues
Back issues available from TEMPUS Publications
| Copyright ?2000 TEMPUS Publications |
Published 6 per annum | It is a condition of publication that manuscripts submitted to this journal have not been published and will not to be simultaneously submitted or published elsewhere. By submitting a manuscript, the authors agree that the copy for their article is transferred to the publisher, if and when the article is accepted for publication. However, assignment of copying is not required from authors who work for organizations which do not permit such assigment. The copyright covers the exclusive rights to reproduce and distribute the article, including reprints, photographic reproductions, microform or any other reproductions of similar nature and transactions. No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or by any means, electronic, electrostatic, magnetic tape, mechanical. photocopying, recording or otherwise, without permission in writing from the copyright holder.
Photocopying Information for Users in the U.S.A.
The Item-free Code for this publication indicates that authorization to photocopy items for internal or personal use is granted by the copyright holder for libraries and other users registered with the Copyright Clearance Center (CCC) Transactional Reporting Service provided by the stated fee for copying beyond that permitted by Section 107 or 108 of the United States Copyright Law, is paid. The appropriate remittance of $3.00 per copy per article is paid directly to the Copyright Clearance Center Inc., 27 Congress Street, Salem, MA 01970.
|
刊名字顺( Alphabetical List of Journals):
返回页首 