A|B|C|D|E|F|G|H|I|J|K|L|M|N|O|P|Q|R|S|T|U|V|W|X|Y|Z|ALL

  检 索： 期刊名称 ISSN         高级检索

期刊名称：IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING ISSN： 0894-6507 版本： SCI-CDE 出版频率： Quarterly 出版社： IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 345 E 47TH ST, NEW YORK, NY, 10017-2394   出版社网址： http://www.ieee.org/portal/index.jsp 期刊网址： http://www.cpmt.org/trans/trans-sm.html 影响因子： 0.957(2008) 主题范畴： PHYSICS, APPLIED;    PHYSICS, CONDENSED MATTER;    ENGINEERING, ELECTRICAL & ELECTRONIC;    ENGINEERING, MANUFACTURING 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal IEEE Transactions on Semiconductor Manufacturing is ranked #1 for citations in the field of Engineering and Manufarcturing (source: ISI's Journal Citation Report, 2000). Papers describing techniques used in solving the challenging problems of manufacturing complex microelectronic components. The spectrum of coverage ranges from fundamental to applied. Instructions to Authors It is anticipated that submitted papers will deal with components and devices, materials, reliability and failure modes, and other topics above. Material must be of archival quality and represent new developments and/or directions in packaging technology, or clear advances in existing technology. In recognition of the large "practitioner" audience for these TRANSACTIONS, authors of submitted manuscripts should take pains to make very clear how the manuscript subject extends the knowledge base in the field of technologies underlying components and packaging. In some cases, a manuscript submitted to our Editor may have been previously presented at a conference. This does not disqualify the paper, and we would be pleased to consider it; please advise us the name and dates of the conference when you submit your manuscript. Papers that have been previously published in another archival journal should not be submitted to us for review and inclusion in this archival journal. Please see our Style guide regarding creating a double-spaced version in 10-point type, then converting it to Postscript or PDF, for our review process. Editorial Board Editor: Prof. Duane Boning Massachusetts Institute of Technology Dept. of Electrical Engineering and Computer Science Microsystems Technology Laboratories Room 39-567 60 Vassar Street Cambridge, MA 02139 USA telephone: +1-617-253-0931 email: boning@mtl.mit.edu