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期刊名称:CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES

ISSN:1526-1492
出版频率:Quarterly
出版社:TECH SCIENCE PRESS, PO BOX 900486, PALMDALE, CA, 93590-0486
  出版社网址:http://www.techscience.com/
期刊网址:http://www.techscience.com/cmes/cmes_printed.html
影响因子:4.785(2008)
主题范畴:COMPUTER SCIENCE, SOFTWARE ENGINEERING

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

 

 

At the dawn of this century, which many believe would be the most technologically far-reaching in the history of this planet, the discipline of computer modeling, which lies at the intersection of the bio-info-nano technologies, is poised to bring about revolutionary changes in our lives, in our society, and the world we live in.

Computer Modeling will be the core enabling-discipline for all technological & scientific advances that are yet to be made in this century. It involves a diverse set of research thrusts, in several focus areas, as for instance:
CMES "FOCUS DISCIPLINES":

a) Contemporary Engineering, Physical, Chemical & Biological Sciences;
b) Systems Integration through Computations; and
c) Advanced Communications and Information Processing Technologies

 


Instructions to Authors

 

Manuscript Submission:

Manuscripts may be submitted either electronically, or in hardcopy, to either the Editor-in-Chief, or one of the Associate Editors, at the authors?choice. Refer to "Author's Instruction" for the instructions for typeseeting manuscripts.

Papers submitted in electronic form, to the Editor-in-Chief, should be sent to the e-address:

cmes@care.eng.uci.edu


The letter of transmittal should state that:

(i) the work has not been published, nor is being submitted for publication elsewhere and

(ii) permission for publication, if needed, has already been obtained from appropriate sources. Papers must be written in standard grammatical English; this is the responsibility of the author. The author(s) transfer(s) the copyright to his/their article to Tech Science Press effective if and when the article is accepted for publication. The copyright covers the exclusive and unlimited rights to reproduce and distribute the article in any form of reproduction (printing, electronic media or any other form); it also covers translation rights for all languages and countries. For U.S. authors the copyright is transferred to the extent transferable.

 


Instructions to Authors
1526-1492.pdf

Editorial Board

 

Founder & Editor-in-Chief:

Prof. Satya N. Atluri, D.Sc(h.c)

Samueli/Von Karman Chair in Aerospace Engineering,
University of California , Irvine
5251 California Avenue, Suite 140
Irvine, CA 92612
Tel: 949.824.9946/9966;
Fax: 949.824.9967
E-mail: cmes@care.eng.uci.edu

Associate Editors:
Prof. Ferri M.H. Aliabadi
Department of Engineering, Queen Mary, University of London, Mile End, London E1 4NS, UK

Prof. Wen-Hwa Chen,
Dept. Power Mechanical Engg, National Tsinghua University, Hsinchu, Taiwan

Prof. Lothar Gaul
Institut A fuer Mechanik, Universitaet Stuttgart, Pfaffenwaldring, D-70550 Stuttgart, Germany

Prof. Masanori Kikuchi,
Dept. of Mechanical Engineering, Tokyo University of Science, 2641, Yamazaki, Noda, Chiba, 278-8510, Japan

Prof. Sung W. Lee,
Dept. Aerospace Engg, University of Maryland, College Park, MD, 20742, USA

Prof. Toshihisa Nishioka,
Dept. of Ocean Mech. Engg., Kobe Univ. of Mercantile Marine, 5-1-1 Fukae Minamimachi, Higashinada-ku, Kobe, 658-0022, Japan

Prof. Padraic O'Donoghue,
Dept. of Civil Engg., National University of Ireland, Galway, Ireland

Dr. A.M. Rajendran,
U.S. Army Research Office, P.O. Box: 12211, Research Triangle Park, NC 27709, USA

Dr. Ivatury S. Raju,
Mail Stop 240, NASA Langley Research Center, Hampton, VA 23681, USA

Prof. Wei Shyy,
Dept. of Mech. & Aerospace Engg., University of Florida, Gainesville, FL 32611, USA

Dr. Deepak Srivastava,
Nanotechnology at CSC/NAS, MS 229-1,NASA Ames Res. Center, Moffett Field, CA 94035, USA

Prof. Antonio J.B. Tadeu,
Dept. of Civil Engineering, FCTUC, POLO II, Pinhal de Marrocos, Coimbra, 3000-290, Portugal

Prof. Zhenhan Yao, Dept. of Engineering Mechanics, Tsinghua University, Beijing, 100084, China

Editorial Board:
Prof. Narayan Aluru, Univ. of Illinois at Urbana;
Prof. Shigeru Aoki, Toyo Univ.
Dr. Stephen W. Attaway, Sandia National Labs, Albuquereque;
Prof. P. Z. Bar-Yoseph, Technion-Israel Institute of Technology, Israel;
Prof. Klaus-J黵gen Bathe, M.I.T;
Prof. Romesh Batra, VPI&SU;
Prof. Zdenek P. Ba瀉nt, Northwestern Univ.;
Prof. Michel Bercovier, Hebrew Univ. of Jerusalem;
Prof. Dimitri Beskos, Univ. of Patras;
Prof. Marc Bonnet, Ecole Polytechnique, France;
Prof. Ren?de Borst, TU Delft;
Prof. Franco Brezzi, Univ. of Pavia;
Dr. Frederick W. Brust, Battelle;
Prof. Angelo Carini, University of Brescia;
Prof. C. S. Chen, Univ. of Nevada at Las Vegas;
Dr. E .P. (Tony) Chen, Sandia National labs.,Livermore;
Prof. Kyeongjae Cho, Stanford Univ.;
Prof. Nasr M. Ghoniem, UCLA;
Prof. Somnath Ghosh, Ohio state Univ.;
Prof. Dan Givoli, The Technion, Israel;
Prof. Masashi Iura, Tokyo Denki Univ.;
Prof. John Junkins, Texas A&M Univ.;
Prof. Seung Jo Kim, Seoul National Univ.;
Prof. Albert Kobayashi, Univ. of Washington;
Prof. Byung Man Kwak, Korea Adavanced Inst. of Sci. & Tech.;
Prof. In Lee, Korea Adavanced Inst. of Sci. & Tech.;
Prof. Wing-Kam Liu, Northwestern Univ., Evanston;
Prof. Giulio Maier, Milan Poly. Insitute;
Prof. Udo F. Meissner, Tech. Univ. of Darmstadt;
Prof. Noriyuki Miyazaki, Kyushu Univ.;
Prof. Subrata Mukherjee, Cornell Univ.;
Prof. Hidekazu Murakawa, Osaka Univ.
Prof. Michihiko Nakagaki, Kyushu Institute of Technology;
Prof. Gennadiy Nikishkov, Univ. of Aizu;
Prof. Hiroshi Okada, Kagoshima Univ.;
Prof. K. C. Park, Univ. of Colorado at Boulder;
Prof. Darrell Pepper, Univ. of Nevada at Las Vegas;
Dr. Jacques Periaux, Dassault Aviation, France;
Prof. T.H.H. Pian, M.I.T.;
Prof. Olivier Pironneau, INRIA-Rocquencourt, France;
Dr. Marco Quadrelli, Jet Propulsion Lab;
Prof. K. Shivakumar, North Carolina A&T
Prof. J. Sladek, Slovak Academy of Sciences, Slovakia;
Prof. J. Soric, Univ. of Zagreb, Croatia;
Prof. Zhigang Suo, Princeton Univ.;
Prof. Kumar Tamma, Univ. of Minnesota;
Dr. Vinod Tewary, NIST, Boulder,USA
Prof. Yoshihiro Tomita, Kobe Univ.;
Prof. Pin Tong, HK Univ. of Sci. & Tech.;
Prof. Shinobu Yoshimura, Univ. of Tokyo;
Prof. Mingwu Yuan, Peking Univ., China


 



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