期刊名称：AI EDAM-ARTIFICIAL INTELLIGENCE FOR ENGINEERING DESIGN ANALYSIS AND MANUFACTURING
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
AI EDAM is a journal for engineers and designers who see AI technologies as powerful means for solving difficult engineering problems; and researchers in AI and computer science who are concerned with applications of AI and in the theoretical issues that arise from such applications. The journal publishes original articles about significant theory and applications based on the most up-to-date research in all branches and phases of engineering. Suitable topics include: analysis and evaluation; configuration and design; manufacturing and assembly; and concurrent engineering. Specifically, topics of interest are the use of AI in planning, design, analysis, simulation, spatial reasoning and graphics, manufacturing, assembly, process planning, scheduling, numerical analysis, optimization, distributed system and multi-agent applications. AI EDAM publishes original and major applications of state-of-the-art knowledge-based techniques to important engineering problems (termed 'practicum papers').
Instructions to Authors
a0890-0604.pdf
Editorial Board
Editor
David C. Brown
Computer Science
WPI
100 Institute Road
Worcester, MA 01609-2280
Email aiedam@cs.wpi.edu Associate Editor
Mary Lou Maher
University of Sydney, Australia
Email mary@arch.usyd.edu.au
Ian Smith
Ecole Polytechnique Fédérale, Switzerland
Email Ian.Smith@epfl.ch Editorial Board
Alice M. Agogino
University of California, Berkeley, USA
Email aagogino@euler.berkeley.edu
Dan Braha
Ben-Gurion University, Israel
Email brahad@bgumail.bgu.ac.il
Jonathan Cagan
Carnegie Mellon University, USA
Email cagan@cmu.edu
Per Christiansson
Aalborg University, Denmark
Email pc@civil.auc.dk
Alex H.B. Duffy
University of Strathclyde, Scotland
Email alex@cad.strath.ac.uk
Boi Faltings
Ecole Polytechnique Fédérale, Switzerland
Email Boi.Faltings@epfl.ch
Steven J. Fenves
Carnegie Mellon University, USA
Email sfenves@cme.nist.gov
Donal Finn
University College, Dublin, Ireland
Email donal.finn@ucd.ie
Mark S. Fox
University of Toronto, Canada
Email msf@mie.utoronto.ca
John S. Gero
University of Sydney, Australia
Email john@arch.usyd.edu.au
Ashok K. Goel
Georgia Institute of Technology, USA
Email goel@cc.gatech.edu
Roderick A. Grupen
University of Massachusetts at Amherst, USA
Email grupen@cs.umass
Mark Klein
Massachusetts Institute of Technology, USA
Email m_klein@mit.edu
John C. Kunz
Stanford University, USA
Email kunz@ce.stanford.edu
Jean-Claude Latombe
Stanford University, USA
Email latombe@cs.stanford.edu
Wolfgang Nejdl
Universitat Hannover, Germany
Email nejdl@kbs.uni-hannover.de
Panos Papalambros
University of Michigan, USA
Email pyp@caen.engin.umich.edu
H. Van Dyke Parunak
Altarum, USA
Email Van.Parunak@altarum.org
William C. Regli
Drexel University, USA
Email regli@drexel.edu
Daniel R. Rehak
Carnegie Mellon University, USA
Email daniel.rehak@cmu.edu
Warren Seering
Massachusetts Institute of Technology, USA
Email seering@mit.edu
Tim Smithers
VICOMTech, Spain
Email tsmithers@vicomtech.es
Markus Stumptner
University of South Australia, Australia
Email mst@cs.unisa.edu.au
Tetsuo Tomiyama
Delft University of Techology, Netherlands
Email t.tomiyama@wbmt.tudelft.nl
Jan H. Vandenbrande
The Boeing Company, USA
Email jan.h.vandenbrande@boeing.com Editor Emeritus (1997-2001)
William P. Birmingham
Grove City College, USA
Email wpbirmingham@gcc.edu Editor Emeritus (1986-1996)
Clive L. Dym
Harvey Mudd College, Claremont, USA
Email clive_dym@hmc.edu
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