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期刊名称：JOURNAL OF COMPUTATIONAL DESIGN AND ENGINEERING ISSN： 2288-4300 出版频率： Bi-monthly 出版社： OXFORD UNIV PRESS, GREAT CLARENDON ST, OXFORD, ENGLAND, OX2 6DP   出版社网址： https://academic.oup.com/journals 期刊网址： https://academic.oup.com/jcde 影响因子： 5.86 主题范畴： COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS;    ENGINEERING, MULTIDISCIPLINARY 变更情况： Newly Added by 2020 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal Journal of Computational Design and Engineering is a fully open access, international journal that aims to provide academia and industry with a venue for rapid publication of research manuscripts reporting innovative computational methods and applications to achieve a major breakthrough, practical improvements, and bold new research directions within a wide range of design and engineering: Theory and its progress in computational advancement for design and engineering Development of a computational framework to support large scale design and engineering Interaction issues among human, designed artefacts, and systems Knowledge-intensive technologies for intelligent and sustainable systems Emerging technology and convergence of technology fields presented with convincing design examples Educational issues for academia, practitioners, and future generation Proposal for new research directions as well as surveys and retrospectives on the mature field. Examples of relevant topics include traditional and emerging issues in design and engineering but are not limited to: Field-specific issues in mechanical, aerospace, shipbuilding, industrial, architectural, civil, electrical, and biomedical engineering Geometric modelling and processing, solid and heterogeneous modelling, computational geometry, features, and virtual prototyping Computer graphics, image processing, virtual and augmented reality, and scientific visualisation Human modelling and engineering, user interaction and experience, human-computer interaction (HCI), human-machine interface (HMI), human-vehicle interaction (HVI), cognitive engineering, and human factors and ergonomics with computers Knowledge-based engineering, intelligent CAD, AI and machine learning in engineering, and ontology Product data exchange and management, interoperability, data mining and analytics, and database issues Design theory and methodology, sustainable design and engineering, concurrent engineering, and collaborative engineering Digital and virtual manufacturing, rapid prototyping (3D/4D printing) and tooling, and CNC machining Computer-aided inspection, geometric and engineering tolerancing, and reverse engineering Finite element analysis, optimization, meshes and discretization, and virtual engineering Bio-CAD, Nano-CAD, and medical applications Aesthetic design, new media, and design education Survey and benchmark reports.   Instructions to Authors Instructions to Authors Guidelines for Special Issues Manuscript Templates Editorial Board Editor-in-Chief Kunwoo Lee kunwoo@snu.ac.kr Seoul National University, South Korea Co Editors-in-Chief Shuming Gao smago@cad.zju.edu.cn Zhejiang University, China Sang Hun Lee shlee@kookmin.ac.kr Kookmin University, South Korea Jami J. Shah shah.493@osu.edu The Ohio State University, USA Hiromasa Suzuki suzuki@den.t.u-tokyo.ac.jp The University of Tokyo, Japan Editors Balan Gurumoorthy bgm@mecheng.iisc.ernet.in Indian Institute of Science, India Helmut Pottmann pottmann@geometrie.tuwien.ac.at Vienna University of Technology, Austria Myung-Il Roh miroh@snu.ac.kr Seoul National University, South Korea Kenji Shimada shimada@cmu.edut Carnegie Mellon University, USA Editorial Board Members Burcu Akinci bakinci@cmu.edu Carnegie Mellon University, USA Stephen Baek baek@virginia.edu University of Virginia, USA Filipo Berto filippo.berto@ntnu.no Norwegian University of Science and Technology, Norway Young Choi yychoi@cau.ac.kr Chung-Ang University, South Korea Giorgio Colombo giorgio.colombo@polimi.it Politecnico di Milano, Italy Jonathan Corney jonathan.corney@strath.ac.uk University of Strathclyde Glasgow, UK Debasish Dutta dutta@purdue.edu Purdue University, USA Charles Eastman charles.eastman@design.gatech.edu Georgia Tech, USA Anath Fischer meranath@technion.ac.il Technion, Israel Institute of Technology, Israel Martin Fischer fischer@stanford.edu Stanford University, USA Jerry Y. H. Fuh mpefuhyh@nus.edu.sg National University of Singapore, Singapore Rajit Gadh rgadh@seas.ucla.edu University of California, Los Angeles, USA Soonhung Han shhan@kaist.ac.kr Korea Advanced Institute of Science and Technology, South Korea Martin Held held@cosy.sbg.ac.at University of Salzburg, Austria John C. Hsu john.hsu@csulb.edu California State University, USA Shi-Min Hu shimin@tsinghua.edu.cn Tsinghua University, China Leo Joskowicz  josko@cs.huji.ac.il The Hebrew University of Jerusalem, Israel Hong-Bae Jun hongbae.jun@hongik.ac.kr Hongik University, South Korea Yongtae Jun ytjun@sejong.ac.kr Sejong University, South Korea Satoshi Kanai kanai@ssi.ist.hokudai.ac.jp Hokkaido University, Japan Deok-Soo Kim dskim@hanyang.ac.kr Hanyang University, South Korea Heung-Kyu Kim krystal@kookmin.ac.kr Kookmin University, South Korea Inhan Kim ihkim@khu.ac.kr Kyung-Hee University, South Korea Jinman Kim jinman.kim@sydney.edu.au The University of Sydney, Australia Min H. Kim minhkim@vclab.kaist.ac.kr Korea Advanced Institute of Science and Technology, South Korea Tae Wan Kim taewkim@inu.ac.kr Incheon National University, South Korea Tae-Wan Kim taewan@snu.ac.kr Seoul National University, South Korea Wangdo Kim wangdokim@fmh.ulisboa.pt Technical University of Lisbon, Portugal Kwang Hee Ko khko@gist.ac.kr Gwangju Institute of Science and Technology, South Korea Leif Kobbelt kobbelt@informatik.rwth-aachen.de RWTH Aachen University, Germany Bonsang Koo bonsang@seoultech.ac.kr Seoul National University of Science and Technology, South Korea Deok Jin Lee deokjlee@jbnu.ac.kr Jeonbuk National University, South Korea Deukhee Lee deukheelee@gmail.com Korea Institute of Science and Technology, South Korea Jae Yeol Lee jaeyeol@chonnam.ac.kr Chonnam National University, South Korea Jongsoo Lee jleej@yonsei.ac.kr Yonsei University, South Korea Joo-Haeng Lee joohaeng@gmail.com Electronics and Telecommunications Research Institute, South Korea Soo-Hong Lee shlee@yonsei.ac.kr Yonsei University, South Korea Wonsook Lee wslee@uottawa.ca University of Ottawa, Canada Yong Gu Lee lygu@gist.ac.kr Gwangju Institute of Science and Technology, South Korea Teo Ai Lin bdgteoal@nus.edu.sg National University of Singapore, Singapore Zhiliang Ma mazl@tsinghua.edu.cn Tsinghua University, China Takashi Maekawa maekawa@ynu.ac.jp Yokohama National University, Japan Jun Mitani mitani@cs.tsukuba.ac.jp University of Tsukuba, Japan Duhwan Mun dhmun@korea.ac.kr Korea University, South Korea Ahmad H. Nasri anasri.82@gmail.com Boulder Graphics LLC, USA Gunwoo Noh gunwoonoh@korea.ac.kr Korea University, South Korea Sangdo Noh sdnoh@skku.edu Sungkyunkwan University, South Korea Hyungjun Park hzpark@chosun.ac.kr Chosun University, South Korea Sangchul Park scpark@ajou.ac.kr Ajou University, South Korea Alexander Pasko apasko@bournemouth.ac.uk Bournemouth University, UK Jean-Philippe Pernot jean-philippe.pernot@ensam.eu Arts et Metiers ParisTech, France Tom Peters tpeters@cse.uconn.edu University of Connecticut, USA Kishore Pochiraju kishore.pochiraju@stevens.edu Stevens Institute of Technology, USA Hong Qin qin@cs.sunysb.edu Stony Brook University, USA Sudarsan Rachuri sudarsan.rachuri@hq.doe.gov Department of Energy, USA Ravipudi Venkata Rao ravipudirao@gmail.com Sardar Vallabhbhai National Institute of Technology, India John Rasmussen jr@m-tech.aau.dk Aalborg University, Denmark Tathagata Ray rayt@hyderabad.bits-pilani.ac.in Birla Institute of Technology and Science, Pilani, India Caterina Rizzi caterina.rizzi@unibg.it University of Bergamo, Italy Takis Sakkalis psakkalis@aua.gr Agricultural University of Athens, Greece Mohsen Sheikholeslami mohsen.sheikholeslami@nit.ac.ir Babol Noshirvani University of Technology, Iran Ki-Hoon Shin shinkh@seoultech.ac.kr Seoul National University of Science and Technology, South Korea Josip Stjepandic Josip.Stjepandic@PROSTEP.com PROSTEP AG, Croatia Yong Suh suhy@ecs.csus.edu California State University, USA Joshua D. Summers jsummer@clemson.edu Clemson University, USA Jian Sun sunjian0813@gmail.com Tsinghua University, China Kai Tang mektang@ust.hk Hong Kong University of Science and Technology, China Tetsuo Tomiyama t.tomiyama@cranfield.ac.uk Cranfield University, UK Davide Tumino davide.tumino@unikore.it Kore University of Enna, Italy Michael Yu Wang mywang@ust.hk Hong Kong University of Science and Technology, China Xiangyu Wang Xiangyu.Wang@curtin.edu.au Curtin University, Australia Magnus Wiktorsson magwik@kth.se KTH Royal Institute of Technology, Sweden Ali Rıza Yildiz aliriza@uludag.edu.tr Uludag University, Turkey Byounghyun Yoo yoo@byoo.net Korea Institute of Science and Technology, South Korea Yong Zeng yong.zeng@concordia.ca Concordia University, Canada