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期刊名称:SENSORS AND ACTUATORS A-PHYSICAL

ISSN:0924-4247
版本:SCI-CDE
出版频率:Semi-monthly
出版社:ELSEVIER SCIENCE SA, PO BOX 564, LAUSANNE, SWITZERLAND, 1001
  出版社网址:http://www.elsevier.com/
期刊网址:http://www.elsevier.com/locate/issn/09244247
影响因子:3.407
主题范畴:ENGINEERING, ELECTRICAL & ELECTRONIC;    INSTRUMENTS & INSTRUMENTATION

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

 

Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:

Fundamentals and Physics such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement.

Materials and their Processing such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.

Optoelectronic sensors such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.

Mechanical sensors such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.

Thermal sensors such as: platinum resistors, thermistors, diode temperature sensors, silicon transistor thermometers, integrated temperature transducers, PTAT circuits, thermocouples, thermopiles, pyroelectric thermometers, quartz thermometers, power transistors and thick-film thermal print heads.

Magnetic sensors such as: magnetoresistors, Corbino disks, magnetodiodes, Hall-effect devices, integrated Hall devices, silicon depletion-layer magnetometers, magneto-injection transistors, magnistors, lateral magnetotransistors, carrier-domain magnetometers, MOS magnetic-field sensors, solid-state read and write heads.

Micromechanics such as: research papers on actuators, structures, integrated sensors-actuators, microsystems, and other devices or subdevices ranging in size from millimetres to sub-microns; micromechatronics; microelectromechanical systems; microoptomechanical systems; microchemomechanical systems; microrobots; silicon and non-silicon fabrication techniques; basic studies of physical phenomena of interest to micromechanics; analysis of microsystems; exploration of new topics and materials related to micromechanics; microsystem-related problems like power supplies and signal transmission, microsystem-related simulation tools; other topics of interest to micromechanics.

Interface electronics: electronic circuits which are designed to interface directly with the above transducers and which are used for improving or complementing the characteristics of these devices, such as linearization, A/D conversion, temperature compensation, light-intensity compensation, current/frequency conversion and microcomputer interfacing.

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Instructions to Authors

 

Aims and Scope
Sensors and Actuators A brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals.

Sensors and Actuators A regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:

Fundamentals and Physics such as: classification of effects, physical effects,measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement.
Materials and their Processing such as: piezoelectric materials, poly- mers, metal oxides, III V and II VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.
Optoelectronic sensors such as: photovoltaic diodes, photoconductors,photodiodes, phototransistors, position-sensitive photodetectors, optoisolators, photodiodearrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.
Mechanical sensors such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.
Thermal sensors such as: platinum resistors, thermistors, diode temperature sensors, silicon transistor thermometers, integrated temperatur transducers, PTAT circuits, thermocouples, thermopiles, pyroelectric thermometers, quartz thermometers, power transistors and thick-film thermal print heads.
Magnetic sensors such as: magnetoresistors, Corbino disks, magnetodiodes, Hall-effect devices,integrated Hall devices, silicon depletion-layer magnetometers, magneto-injection transistors, magnistors, lateral magnetotransistors, carrier-domain magnetometers, MOS magnetic-field sensors, solid-state read and write heads.
Micromechanics such as: research papers on actuators, structures, integrated sensors actuators, microsystems, and other devices or subdevices ranging in size from millimetres to sub-microns; micromechatronics; microelectromechanical systems; microrobots silicon and non-silicon fabrication techniques; basic studies of physical phenomena of interest to micromechanics; analysis of microsystems; exploration of new topics related to micromechanics; microsystem-related problems like power supplies and signal transmission; microsystem-related simulation tools; other topics of interest to micromechanics.
Interface electronics: electronic circuits which are designed to interface directly with the above transducers and which are used for improving or complementing the characteristics of these devices, such as linearization, A/D conversion, temperature compensation, light-intensity compensation, current/ frequency conversion and microcomputer interfacing.
Sensor Systems and Applications such as: sensor buses,multiple-sensor systems, sensor networks, voting systems, telemetering, sensor arrays, and automotive, environmental, monitoring and control, consumer, medical, alarm and security,robotic, nautical, aeronautical and space measurement systems.

Contributions are accepted on the understanding that the authors have obtained the necessary authority for publication.Submission of an article must be accompanied by a statement that the article is original and unpublished and is not being considered for publication elsewhere. Upon acceptance of an article by the journal, the author(s) will be asked to transfer the copyright of the article to the publisher. This transfer will ensure the widest possible dissemination of information.

Preparation of papers
General
All papers should be concisely written. The length of original contributions should not in general exceed 5000 words or about 12 printed pages including tables and diagrams. Letters to the Editor intended for more speedy publication are also welcomed. These should not exceed 2000 words or 4 printed pages.Papers should be written in English (American or British spelling but with use of only one form in the same paper). The author should remember that the journal is international and read widely by those whose first language may be other than that in which the paper is written. Clarity and precision are best achieved by the use of short words and simple sentences. Papers which do not satisfy the English language requirements will not be accepted.
Authors in Japan please note that information about how to have the English of your paper checked, corrected and improved(before submission) is available from:

Elsevier Science K.K.
Higashi Azabu 1-Chome Building 4F
1-9-5 Higashi Azabu, Minato-ku
Tokyo 106
Japan
Tel:+81(03) 5561 5032
Fax: +81 (03) 5561 5045

Papers (except papers originating from North and South America or Japan or those for the Micromechanics Section) should be submitted to the Editor:
Prof. P.J. French
Delft University of Technology
Faculty of Electrical Engineering
Electronic Instrumentation Laboratory
Mekelweg 4, room 13.260
2628 CD Delft
The Netherlands

or to the Editor for N. & S.America:
Professor J. Van der Spiegel
University of Pennsylvania
School of Engineering and Applied Science
Center for Sensor Technologies
200 South 33rd Street, Philadelphia, PA19104-6390
USA,

or to the Editor for Japan:
Professor Masanori Okuyama
Department of Physical Science
Graduate School of Engineering Science
Osaka University
1-3 Machinkaneyama-cho
Toyonaka
Osaka 560-8531
Japan

Papers for the Micromechanics Section should be submitted to the Coordinating Editor:
Professor J. E.Wood
Department of Mechanical Engineering
University of New Mexico
Albuquerque, NM 87131
USA

Online Submission of Papers Authors are encouraged to submit their paper online to one of the editors by using the Elsubmit Online Submission tool for Sensors and Actuators A: Physical at http://www.elsevier.com/locate/sensors. To submit online, authors are required to go to this website and upload their article (compuscript) and its assosciated artwork, an electronic (PDF) proof is generated and the reviewing process is carried out using that PDF. Authors and editors send and recieve all corresponence by e-mail via the website and no paper correspondence is performed. Full instructions on how to use the online submission tool and how to prepare your manuscipt for online submission are available at http://www.elsevier.com/locate/sensors

Submission of Papers by Mail Three copies of the manuscript should be submitted. For the final version, authors should submit one original with figures, two hard copies, and one electronic version of their manuscript on disk. The typescript should be indouble-spaced typing on pages of uniform size with a wide margin on the left. This applies also to tables, legends for illustrations, references and footnotes. The margin and double spacing greatly facilitate editorial processing. Each table should be typed on a separate page, and the legends to illustrations should be typed in sequence on a separate page, widely spaced. Typescripts should be preceded by a sheet of manuscript paper bearing the name, address, phone, fax and e-mail of the person to whom proofs are to be sent and indicating the number of pages in the typescript.
Some flexibility of presentation will be allowed, but authors are urged to arrange the subject matter clearly and logically under such headings as Introduction, Experimental, Results, Discussion,etc.
Title
Papers should be headed by a concise but informative title. This should be followed by the names of the authors and by the name and address of the laboratory in which the work was performed. If the address of the author at the time when the paper will appear will be other than that where the work was carried out, this may be stated in a footnote. Acknowledgments for financial support should not be made by a footnote to the title or name of the author but should be included in Acknowledgments at the end of the paper.
Abstract
All papers should have an Abstract on a separate sheet. The abstract (preferably 50 200 words) should comprise a brief and factual account of the contents and conclusions of the paper as well as an indication of any new information presented and its relevance. Complete sentences should be used, without unfamiliar abbreviations or jargon. The use of the present tense is customary.
Key words
Authors are requested to provide4 6 key words. These should follow the Abstract.
Introduction
All papers should have a short Introduction. This should state the reasons for the work, with brief reference to previous work on the subject.
References
The references should be numbered consecutively throughout the text and should be collected together in a reference list(headed References) at the end of the paper.
The list of references should be given on a separate sheet of the manuscript. Footnotes and legends should not include bibliographic material,and reference lists should not include material that could more appropriately appear as a footnote.Authors should ensure that every reference appearing in the text is in the list of references and vice versa. Numerals for references are enclosed in square brackets in the text, e.g., [1]; numerals referring to equations are enclosed in parentheses.
The abbreviated titles of periodicals should conform to standard abbreviations such as those given in the INSPEC Science Abstracts Lists of Journals,regularly appearing in Electrical and Electronics Abstracts.
The following system of giving references is required:
Journals:
Reference number (on the line without a full stop) authors' names (preceded by initials and in upper and lower case) comma title of article comma abbreviated title of the periodical comma volume number year (in parentheses) page numbers full stop.
Example:
1 D. A. Antoniadis and R. W. Dutton,Models for computer simulation of complete IC fabrication process, IEEE Trans. Electron Devices, ED-26 (1979) 490 500.
Books:
(1) Monographs: reference number (on the line without a full stop) authors' names (preceded by initials and in upper and lower case) comma title of book comma part or volume (abbreviated to Vol.) number comma publisher's name comma city of publication comma no. of edition (edn.) comma year of publication comma page number(s) (preceded by p. or pp.) full stop.
Example:
2 A. Nadai, Theory of Flow and Fracture of Solids, Vol. 1, McGraw-Hill, New York, 2nd edn., 1950, p. 350.
(2) Multi-author volumes: reference number(on the line without a full stop) authors' names (precede by initials and in upper and lower case) comma in editor's name (preceded by initials, in upper and lower case and followed by (ed.)) comma title of book comma part or volume (abbreviated to Vol.)number comma publisher's name comma city of publication comma no. of edition (edn.) comma year of publication comma chapter (abbreviated to Ch.) number comma page number(s) (preceded by p. or pp.) full stop.
Example:
3 B. Danielsson and K. Mosbach,in K. Mosbach (ed.), Methods in Enzymology, Vol. 137, Academic Press, New York,1988, Ch. 16, pp. 181 197.
Conference Proceedings:
Reference number (on the line without a full stop) authors' names (preceded by initials and in upper and lower case) comma title of article comma title of proceedings comma conference location comma conference date comma page number(s) (preceded by p. or pp.) full stop.
Example:
4 K. E. Petersen, Silicon sensor technologies, Tech. Digest, IEEE Int. Electron Devices Meet., Washington, DC, USA, Dec. 2 7, 1985.
A reference to "to be published in [title of periodical]" or "in press" implies that the paper has already been accepted for publication. A name appearing in the text which refers to a person as originator of an unpublished idea is listed in the References as a "personal communication".
In the text an author's name is given without initials except where it is wished to avoid confusion with namesakes.
When reference is made to a publication written by more than two authors it is preferable to give only the first author's name in the text followed by et al.. or the name of one of the authors followed by "and coworkers". In the list of references the names and initials of all authors must be given.
This journal should be cited as Sensors and Actuators A.
Tables
Careful thought should be given to the layout of tables (and figures) so that the significance of the results may be quickly grasped by the busy reader. Often a table of results can be understood more readily if columns and lines are interchanged. It should also be remembered that the length of a printed page is always greater than its width. Tables with only two or three headings are best printed horizontally, e.g.,
Time (h) 0.1 0.25 0.5 1.0 3.0 6.0
Oxidant consumption (mol mol-1)2.11 2.90 3.66 4.55 4.88 4.96
Tables are to be numbered serially with arabic numerals, and should have headings which make their general meaning understandable without reference to the text. The units in which results are expressed should be given in parentheses at the top of each column and should not be repeated on each line of the table. Footnotes should be indicated by the use of lower case letters (a, b, c, etc.)as superscripts without parentheses.

Illustrations
Original line drawings and cyclic or aromatic chemical formulae should be in a form suitable for direct reproduction, drawn in Indian ink on drawing or tracing paper. Photographs and electronmicrographs should be black and white glossy prints and as rich in contrast as possible. Where magnifications are concerned, it is preferable to indicate the scale by means of a ruled line on the photograph. There is no need to specify reductions for figures; however, figures will generally be reduced in size before printing and authors are urged to ensure that any lettering is sufficiently large (minimum height 3 5 mm) to remain legible.Care should be taken when submitting computer graphics to ensure that labelling is of sufficient size and quality. All illustrations should preferably require the same degree of reduction and be submitted on paper of the same size, or smaller than the main text to prevent damage in transit. Legends to illustrations should be typed in sequence on a separate page or pages and be understandable without reference to the text. All illustrations should be clearly referred to in the text using arabic numerals.
Biography
A short biography of the author(s) should follow the references. It should cover such information as the author(s) degree(s), where and in what year they were obtained, present employment, and current fields of interest. Photographs are not required.

Submission of electronic text

  • Articles prepared using any of the more popular word-processing packages are acceptable, but please note the following points.
  • Submissions should be made on a double-density or high-density 3.5" diskette or5.25" floppy disk. Take care to ensure that the disk is formatted to its physical specification.
  • The disk must always be accompanied by a hard-copy version of the article,and the two must be identical.
  • Disks formatted for either MS-DOS or Apple Macintosh compatibility are acceptable. If you can provide either of these, our preference is for the former.
  • The article must be saved in the native format of the word processor used, e.g.WordPerfect, Microsoft Word, etc.
  • Although most popular word processor file formats are acceptable, we cannot guarantee the usability of all formats. If the disk you send us proves to be unusable, we will publish your article from the hard copy. Our preferred format is MS-DOS with WordPerfect 5.1.
  • If you send ASCII files, it is helpful to adhere to the following guidelines:
    ?matter to be subscripted or superscripted should be placed between curly brackets, and preceded by an underscore (_) in the case of subscripts or a hat symbol (^) for superscripts. For example: H_{2}O codes H2O, T^{3} codes T3.
  • The disk format, word-processor format, file name(s) and the title and authors of the article must be indicated on the disk.
  • There is no need to spend time formatting your article so that the printout is visually attractive (e.g. by making headings bold or creating a page layout with figures),as most formatting instructions will be removed upon processing.
  • Leave a blank line between each paragraph and between each entry in the list of bibliographic references.

Proofs
Authors will receive proofs which they are requested to correct and return as soon as possible.
Since priority is established by the date of receipt of a paper, it is essential that no new material be inserted in the text at the time of proof-reading. A "note added in proof" will be accepted only if permission from the editors has been obtained; this will bear the date of receipt.

Reprints
A total of 25 reprints of each paper will be supplied free of charge to the author(s). Additional reprints can be ordered at prices shown on the reprint order form which will accompany the proofs.

There are no page charges.

Symbols, formulae and equations
Symbols, formulae and equations should be written with great care, capitals and lower case letters being distinguished where necessary. Also a clear distinction in typewritten text should be made between the figure 1 (one) and the lower case l (ell), the letters "o" and zero, "k" and kappa, "u" and mu, "v" and nu, and "n" and eta. Particular care should be taken in writing mathematical expressions containing superscripts and subscripts. Greek letters and unusual symbols employed for the first time should be defined by name in the left-hand margin.
The solidus / maybe used in equations to economize vertical space but its use should be consistent. For example:
A/b = x2/(u + v)1/2
but it is pointless to write
A/b = x2
(u +v)1/2.
It is recommended that natural logarithms should be denoted by ln while decade logarithms should be denoted by lg. Exponentials are better written as exp(a) than ea.
The multiplication sign should be used in floating point numbers to avoid confusion, i.e., 4.25 x105, not 4.25.105. The decimal point should always be denoted by a full stop.
To avoid the confusion that results from the differing uses of the comma and full stop, we recommend separating the digits by a space into groups of three,counting left or right from the decimal sign (not necessary with a four-digit number).
For example: 16 132 4372 8.2487 1.232 843

Abstracting Services
This journal is cited by the following Abstracting Services: The American Ceramic Society, Cambridge Scientific Abstracts, Chemical Abstracts, Compendex, Computer and Control Abstracts, Current Contents, EIC/Intelligence, Electrical and Electronic Abstracts, Engineered Materials Abstracts, FIZ Karlsruhe, Metals Abstracts, PASCAL/CNRS, Physics Abstracts, Science Citation Index, The Engineering Index Annual, The Engineering Index Monthly.

Spellings used for some common words
aging
antireflection
artifact
band bending
bandgap
bandwidth
co-evaporate
cross section
cross-sectional
crosstalk
feedback (adj.)
flat-band(adj.)
Gaussian
Kirchhoff
lifetime
linewidth
microelectronics
micromechanics midpoint
multilayer
multi-target
non-crystalline
n-type(adj.)
open-circuit (adj.)
photoemission
photogenerate
photoresist
p-type (adj.)
printout
readout
reverse-bias (adj.)
rod-like (adj.)
semicontinuous
short-circuit (adj.)
single-crystal (adj.)
stepwise
submicron
thermoelectric
ultrahigh
waveband
waveform
wavelength
wavenumber


Editorial Board

 

Editor-in-Chief:

P.J. French, Delft University of Technology, Faculty of Electrical Engineering, Electronic Instrumentation Laboratory, Mekelweg 4, room 13.260, 2628 CD Delft, The Netherlands

Editor for N. & S. America:

J. Van der Spiegel, University of Pennsylvania, School of Engineering and Applied Science, Center for Sensor Technologies, Philadelphia, PA 19104-6390, USA

Editor for Japan:

M. Okuyama, Department of Physical Science, Graduate School of Engineering Science, Osaka University, 1-3 Machinkaneyama-cho, Toyonaka, Osaka 560-8531, Japan

Coordinating Editor for Micromechanics Section:

J.E. Wood, University of New Mexico, Department of Mechanical Engineering, Albuquerque, NM 87131, USA

General Editor:

P.J. French, Delft University of Technology, Faculty of Electrical Engineering, Electronic Instrumentation Laboratory, Mekelweg 4, room 13.260, 2628 CD Delft, The Netherlands

Editorial Board:

M. Ai, Kashiwa-City, Japan

M.-H. Bao, Shanghai, People's Rep. of China

W. Benecke, Bremen, Germany

G. Blasquez, Toulouse, France

S. Bouwstra, Amsterdam, Netherlands

A. D'Amico, Rome, Italy

M. Esashi, Sendai, Japan

H. Fujita, Meguro-ku,Tokyo, Japan

Y.B. Gianchandani, Ann Arbor, MI, USA

K.T.V. Grattan, London, UK

R.T. Howe, Berkeley, CA, USA

K. Ikuta, Nagoya, Japan

W.H. Ko, Cleveland, OH, USA

T. Kobayashi, Yokohama, Japan

G. Kovacs, Stanford, CA, USA

J.H. Lang, Cambridge, MA, USA

W. Lang, Bremen, Germany

M.A. Marcus, Rochester, NY, USA

C.H. Mastrangelo, Ann Arbor, MI, USA

S. Middlehoek - Founding Editor, GA Delft, The Netherlands

A. Nathan, Waterloo, Ontario, Canada

O. Paul, Freiburg, Germany

K.E. Petersen, Fremont, CA, USA

R. Puers, Heverlee, Belgium

N.F. de Rooij, Neuchâtel, Switzerland

C. Roumenin, Sofia, Bulgaria

S.D. Senturia, Cambridge, MA, USA

S. Shoji, Tokyo, Japan

O. Tabata, Shiga, Japan

Yu-Chong Tai, Pasadena, CA, USA

H.A.C. Tilmans, Leuven, Belgium

K.D. Wise, Ann Arbor, MI, USA

M.C. Wu, Los Angeles, USA

H. Yamasaki, Tokyo, Japan



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