期刊名称：INTERMETALLICS
 期刊简介(About the journal)
投稿须知(Instructions to Authors)
编辑部信息(Editorial Board)
About the journal
Intermetallics is concerned with all aspects of ordered chemical compounds between two or more metals and notably with their applications.
On the more fundamental side, the journal covers: the crystal chemistry and bonding theory of intermetallics; determination and analysis of phase diagrams; the nature of superlattices, antiphase domains and order-disorder transitions; the geometry and dynamics of dislocations and related defects in intermetallics; theory and experiments relating to flow stress, work-hardening, fatigue and creep; reponse of deformed intermetallics to annealing; magnetic and electrical properties of intermetallics; structure and properties of grain and interphase boundaries; the effect of deviations from stoichiometry on physical and mechanical properties; crystallization of intermetallics from the melt or amorphous precursors. Papers on methods of characterizing intermetallics will be welcome. All aspects of phase transformations involving intermetallics will be covered. The principles governing microstructural features of multiphase intermetallic alloys will also be included, as will experimental and theoretical work on diffusion in intermetallics. Papers on metal hydrides are also welcome. The study of bulk metallic glasses is a recently developed field which will be covered in all its range in Intermetallics. So will all aspects, fundamental and applied, of shape-memory alloys.
With regard to applications of intermetallics, the journal published papers on all aspects of processing, including melting, casting, fabrication, sintering and hot-pressing and self-sustaining high-temperature synthesis; the microstructural response of multiphase intermetallic alloys to heat-treatment and the effect of such treatment on properties; environmental effects on mechanical and magnetic properties and their interpretation and control; practical applications of all kinds of intermetallics (both structural and functional), and bulk metallic glasses; multiphase intermetallics alloys for dental use; hard magnetic materials based on intermetallics; superconducting intermetallics.
Instructions to Authors
Submission of Papers
Authors are requested to submit their original manuscript and figures with three copies to any of the Editors, but the following procedure is preferred: Contributors in the Americas may submit their papers to Dr C.T. Liu, Metals and Ceramics Division, Oak Ridge National Laboratory, PO Box 2008, Oak Ridge, TN 37831-6115, USA; contributors from German-speaking countries to Dr G. Sauthoff, Max-Planck-Institut fur Eisenforschung, Postfach 140444, D-40074 Desseldorf, Germany; contributors from Japan and Korea to Professor Yoshinao Mishima, Materials Science and Engineering, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226-8502, Japan; contributors from the UK, continental Europe (other than German-speaking countries), and India to Professor D. Morris, Department of Physical Metallurgy, CENIM, CSIC, Avenida Gregorio del Amo 8, 28040 Madrid, Spain; contributors from China to Dr R. Yang, Titanium Alloy Laboratory, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 11015, China. Authors from other countries should submit to any Editor. Editors will reach their decisions independently.
All papers should be written in English.
Submission of a paper implies that it has not been published previously, that it is not under consideration for publication elsewhere, and that if accepted it will not be published elsewhere in the same form, in English or in any other language, without the written consent of the publisher.
Types of Contributions
(1) Research Papers (experimental or theoretical). An abstract and five key words are required.
(2) Review Papers. These will normally be invited by one of the Editors, but suggestions for topics and/or authors will be welcomed. Such suggestions should be sent to the Chairman of the Editors.
(3) Short Communications. These should not exceed 1000 words and should have no more than three illustrations. A very brief abstract and five key words are required.
(4) Comments on papers published in Intermetallics. Such comments will normally be published together with a reply from the Author(s).
Manuscript Preparation
General: Manuscripts must be typewritten, double-spaced with wide margins on one side of white paper. Good quality printouts with a font size of 12 or 10 pt are required. The corresponding author should be identified (include a Fax number and E-mail address). Full postal addresses must be given for all co-authors. Authors should consult a recent issue of the journal for style if possible. An electronic copy of the paper should accompany the final version. The Editors reserve the right to adjust style to certain standards of uniformity. Authors should retain a copy of their manuscript since we cannot accept responsibility for damage or loss of papers. Original manuscripts are discarded one month after publication unless the Publisher is asked to return original material after use.
Paper Length: Generally, the length of the manuscript should be the minimum consistent with clarity.
Abstracts: Each paper should be provided with an abstract of 100-150 words and five key words for use in indexing.
Text: Follow this order when typing manuscripts: Title, Authors, Affiliations, Abstract, Keywords, Main text, Acknowledgements, Appendix, References, Figure Captions and then Tables. Do not import the Figures or Tables into your text. The corresponding author should be identified with an asterisk and footnote. All other footnotes (except for table footnotes) should be identified with superscript Arabic numbers.
The use of proprietary names of alloys and instruments should be avoided as far as possible but may be accepted if the proprietary name is a universally known description of the category in question, e.g. NIMONIC. Papers essentially of an advertising nature will not be accepted.
Units: The SI system should be used for all quantitative data, though values in other systems may be added in parentheses after the SI units if the authors consider it necessary. Temperatures should be given in Celsius ( C) or Kelvin (K) scales. No full stop should be used in abbreviated units. Compound units should take the form, e.g. m2/s, not m2 . s-1. The meaning of all abbreviations should be spelled out in full when first used, with the abbreviations following in brackets.
Mathematical and technical settings: Equations and formulae should be typewritten wherever, possible. Equations should be numbered consecutively with Arabic numerals in parentheses on the right hand side of the page. Special symbols should be identified in the margin, and the meaning of all symbols should be explained in the text where they first occur. If you use several symbols, a list of definitions (not necessarily for publication) will help the editor. Type or mark mathematical equations exactly as they should appear in print.
References: All publications cited in the text should be presented in a list of references following the text of the manuscript. In the text refer to references by a number in square brackets on the line (e.g. Since Backer[1]), and the full reference should be given in a numerical list at the end of the paper.
References should be given in the following form:
1. Backer I, Schulson EM, Michael JR. Phil Mag 1992;B57:379.
2. Vedula K, Hahn KH, Boulogne B. In: High Temperature Ordered Intermetallic Alloys 3. MRS Symp Proc 1989;133:299.
3. Yamaguchi M, Nishtani SR, Shirai Y. In: Whang SH et al, editor. High temperature aluminides and intermetallics. Warrendale, USA: TMS, 1990. p. 63.
4. Ananatharaman TR, Suryanarayana C. Rapidly solidified metals. Aedermansdorf, Switzerland: Trans Tech Publications, 1987. p. 25.
Illustrations: All illustrations should be provided in camera-ready form, suitable for reproduction (which may include reduction) without retouching. Photographs, charts and diagrams are all to be referred to as "Figure(s)" and should be numbered consecutively in the order to which they are referred. They should accompany the manuscript, but should not be included within the text. All illustrations should be clearly marked on the back with the figure number and the author's name. All figures are to have a caption. Captions should be supplied on a separate sheet.
Line drawings: Good quality printouts on white paper produced in black ink are required. All lettering, graph lines and points on graphs should be sufficiently large and bold to permit reproduction when the diagram has been reduced to a size suitable for inclusion in the journal. Dye-line prints or photocopies are not suitable for reproduction. Do not use any type of shading on computer-generated illustrations.
Photographs: Original photographs must be supplied as they are to be reproduced (e.g. black and white or colour). If necessary, a scale should be marked on the photograph. Please note that photocopies of photographs are not acceptable.
Colour: Colour printing is available, but the author will be required to pay for the printing costs.
Tables: Tables should be numbered consecutively and given a suitable caption and each table typed on a separate sheet. Footnotes to tables should be typed below the table and should be referred to by superscript lowercase letters. No vertical rules should be used. Tables should not duplicate results presented elsewhere in the manuscript, (e.g. in graphs).
Electronic Submission
Authors should submit an electronic copy of their paper with the final version of the manuscript. The electronic copy should match the hardcopy exactly. Always keep a backup copy of the electronic file for reference and safety. Full details of electronic submission and formats can be obtained from http://www.elsevier.nl/locate/disksub or from Author Services at Elsevier Science.
Proofs
Proofs will be sent to the author (first named author if no corresponding author is identified of multi-authored papers) and should be returned within 48 hours of receipt. Corrections should be restricted to typesetting errors; any others may be charged to the author. Any queries should be answered in full. Please note that authors are urged to check their proofs carefully before return, since the inclusion of late corrections cannot be guaranteed. Proofs are to be returned to the Log-in Department, Elsevier Science, The Boulevard, Langford Lane, Kidlington, Oxford OX5 1GB, UK.
Offprints
Twenty-five offprints will be supplied free of charge. Additional offprints and copies of the issue can be ordered at a specially reduced rate using the order form sent to the corresponding author after the manuscript has been accepted. Orders for reprints (after publication) will incur a 50% surcharge.
Copyright
All authors must sign the "Transfer of Copyright" agreement before the article can be published. This transfer agreement enables Elsevier Science Ltd to protect the copyrighted material for the authors, but does not relinquish the author's proprietary rights. The copyright transfer covers the exclusive rights to reproduce and distribute the article, including reprints, photographic reproductions, microfilm or any other reproductions of similar nature and translations. This includes the right to adapt the article for use in conjunction with computer systems and programs, including reproduction or publication in machine-readable form and incorporation in retrieval systems. Authors are responsible for obtaining from the copyright holder permission to reproduce any figures for which copyright exists.
Author Enquiries:
For enquiries relating to the submission of articles (including electronic submission), the status of accepted manuscripts through our Online Article Status Information System (OASIS), author Frequently Asked Questions and any other enquiries relating to Elsevier Science, please consult http://www.elsevier.com/locate/authors/
For specific enquires on the preparation of electronic artwork, consult http://www.elsevier.com/locate/authorartwork/.
Contact details for questions arising after acceptance of an article, especially those relating to proofs, are provided when an article is accepted for publication.
Editorial Board
Editors:
C.T. Liu, Oak Ridge National Laboratory, Metals and Ceramics Division, PO Box 2008, TN 37831-6115, USA.Email:liuct@ornl.gov
D. Morris, Department of Physical Metallurgy, CENIM, CSIC, Avenida Gregorio del Amo 8, 28040 Madrid, SpainEmail:david.morris@cenim.csic.es
G. Sauthoff, Max-Planck Institut fur Eisenforschung, Postfach 14044, D-400074, Desseldorf, Germany.Email:sauthoff@mpie-duesseldorf.mpg.de
Y. Mishima, Materials Science and Engineering, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226-8502, JapanEmail:mishima@materia.titech.ac.jp
Associate Editor
R. Yang, Titatium Alloy Laboratory, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 110016, ChinaEmail:ryang@imr.ac.cn
Founding Editor
R.W. Cahn, Department of Materials Science and Metallurgy, Cambridge University, Pembroke Street, Cambridge, CB2 3QZ, UKEmail:rwc12@cam.ac.uk
Editorial Board:
I. Baker, Dartmouth College, Hanover, USA
D. Banerjee, Defence Metallurgical Research Laboratory, Hyderabad, India
Y.A. Chang, University of Wisconsin-Madison, USA
G. Chen, University of Science and Technology, Beijing, PRC
H. Clemens, Montan universitat Leoben, Austria
J.M.D. Coey, University of Dublin, Eire
S.C. Deevi, Chrysalis Technologies, Inc., Richmond, VA, USA
D.M. Dimiduk, Wright Patterson AFB, USA
R. Ferro, Universita di Genova, Italy
E.P. George, Oak Ridge National Laboratory, TN, USA
R. Gibala, The University of Michigan, Ann Arbor, USA
R.J. Gottschall, Germantown, MD, USA
G. Gottstein, Rheinisch-Westf lische Technische Hochschule, Aachen, Germany
S. Hanada, Tohoku University, Sendai, Japan
A. Inoue, Institute for Materials Research, Sendai, Japan
H. Inui, Kyoto University, Japan
B. Johnson, California Institute of Technology, Pasadena, CA, USA
Y.W. Kim, UES Inc., Dayton, USA
K.S. Kumar, Brown University, Providence, USA
D. Lin, Shanghai Jiao Tong University, People's Republic of China
J. Loeffler, California Institute of Technology, Pasadena, CA, USA
M.H. Lorretto, The University of Birmingham, UK
M.J. Mills, Ohio State University, OH, USA
M. Nemoto, Kyushu University, Fukuoka, Japan
T.G. Nieh, Lawrence Livermore National Laboratory, CA, USA
K. Otsuka, NAIR, Tsukuba, Japan
J.H. Perepezko, University of Wisconsin-Madison, USA
J.J. Petrovic, Los Alamos National Laboratory, USA
D.G. Pettifor, University of Oxford, UK
P.C. Schmidt, Technische Hochschule Darmstadt, Germany
L. Schultz, Institut fur Festke rper-und Werkstofforschung Dresden, Germany
N.S. Stoloff, Rensselaer Polytechnic Institute, Troy, USA
M. Takeyama, Tokyo Institute of Technology, Japan
D.J. Thoma, Los Alamos National Laboratory, NM, USA
Y. Umakoshi, Osaka University, Japan
P. Veyssiure, CNRS-ONERA, Chatillon, France
S.H. Whang, Polytechnic University, New York, USA
S.-K. Wu, National Taiwan University, Taipei, Taiwan
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