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期刊名称：EXPERIMENTAL MECHANICS ISSN： 0014-4851 版本： SCI-CDE 出版频率： Monthly 出版社： SPRINGER, ONE NEW YORK PLAZA, SUITE 4600 , NEW YORK, United States, NY, 10004   出版社网址： http://www.springer.com/?SGWID=8-102-0-0-0 期刊网址： http://www.springer.com/materials/mechanics/journal/11340 影响因子： 2.808 主题范畴： MATERIALS SCIENCE, MULTIDISCIPLINARY;    MECHANICS;    MATERIALS SCIENCE, CHARACTERIZATION & TESTING 期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)    About the journal   To keep up with the latest research and testing in the field of experimental Mechanics, the world's leading researchers and practitioners turn to Experimental Mechanics for the information they need. Now in its 44th year, Experimental Mechanics is the official journal of the Society for Experimental Mechanics, Inc. Experimental Mechanics is a peer-reviewed quarterly journal presenting innovative research in solid mechanics and materials science. The articles in Experimental Mechanics provide in-depth coverage of the advances in experimental mechanics that are essential to continued development in areas such as: ¡¤ Materials processing and manufacturing technologies ¡¤ Automotive design reliability ¡¤ Civil and offshore structures ¡¤ Earthquake resistant design ¡¤ Electronic packaging ¡¤ Aerospace and surface transportation vehicles ¡¤ Nuclear and gas turbine power ¡¤ Vibration and acoustic testing Instructions to Authors   Submission Manuscript Guidelines: Experimental Mechanics welcomes for review original papers in the following classes: RESEARCH papers describing original investigations which are relevant to experimental mechanics. APPLICATIONS papers emphasizing the application of existing technology for the solution of practical problems in experimental mechanics; and REVIEW papers describing experimental techniques that are still in the research or early-development stage. We invite you to submit the results of your original research for publication in Experimental Mechanics. Authors should submit five (5) copies of the paper, clearly legible, typed double-spaced on only one side of the paper, with illustrations to Teri Barton, SEM Editorial Department, 7 School Street, Bethel, CT 06801 USA. Authors are requested to retain the original manuscript, figures, graphs, and disk. Include an IBM-formatted disk containing the text file of the manuscript with final submission. Note software and version used. Please submit full author name, job title, address, phone, fax, and e-mail for all authors. Papers should be no longer than 4,000 words, with approximately 2 illustrations per page. Detailed instructions for preparing a manuscript for review, along with a manuscript checklist, are available online at www.sem.org or from SEM headquarters.   Editorial Board   Associate Technical Editors K Arakawa ,RIAM, Fukuoka, Japan  Hugh Bruck ,University of Maryland, USA  J Casas ,Technical University of Catalunya, Barcelona, Spain  Ravinder Chona ,Texas A & M University, USA  Horacio Dante Espinosa ,Northwestern University, USA  T Gates ,NASA Langley Research Center, VA, USA  A Gilat ,Ohio State University, Columbus, USA  K S Kim ,Brown University, RI, USA  John Lambros ,University of Delaware, USA  G Schajer ,University of British Columbia, Vanacouver, Canada  Nancy R Sottos ,University of Illinois at Urbana-Champaign, USA  Jeffrey Suhling ,Auburn University, USA  Hareesh Tippur ,Auburn University, AL, USA  Publisher Patricia K Deuschle   Technical Advisor Clyde E Work   International Advisory Board H Aben ,Tallinn Technical University, Estonia  J Dally ,University of Maryland, USA  W Knauss ,California Institute of Technology, Pasadena, CA, USA  A Kobayashi ,University of Washington, USA  A Lagarde ,Universit¨¦ de Poitiers, France  P A A Laura ,Universidad Nacional del Sud, Bahia Blanca, Argentina  R Prabhakaran ,Old Dominion University, USA  Masahisa Takashi ,Aoyama Gakuin University, Tokyo, Japan